​​VINcoNPC X12系列采用Mitsubishi 1200V第7代芯片，可应用于1500V直流母线，功率高达1MW。

 

该中性点钳位模块采用低电感封装，而这种出色的设计也具有众多的优势：针对三电平逆变拓扑结构的连接进行了优化，从而简化母排设计。采用对称布局，使电流和温度分布均匀，以延长电子元件的使用寿命。卓越的功率密度和效率可提高设计的紧凑性。

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主要优势

• 功率高达1MW，效率高达99%，无需并联模块
• 加强了三电平逆变拓扑结构的优势，并减轻了设计负担
• 完全对称的布局可确保更好的均流，同时提升可靠性
• 现已推出预涂相变材料的版本

 

目标应用

• 光伏
• UPS

 

目前，您已可通过常规渠道获取我们的样品。

 

（翻译校对：Warren Wang，编辑：Anna Chai）
 

 

​ENGINEERED TO UP POWER & EFFICIENCY

 

VINcoNPC X12 featuring Mitsubishi 1200 V gen 7 chips for 1500 V DC-link applications up to 1 MW

 

Housed in a low-inductive package, this neutral-point clamped module’s superior design comes with many benefits: Connections are optimized for three-level topologies simplifying the busbar design. The symmetrical layout serves to share current uniformly and distribute temperature evenly to extend component life. The outstanding power density and efficiency enables more compact designs.

Main benefits

• Up to 1 MW at 99 % efficiency without paralleling modules
• Enhances three-level topologies’ benefits and reduces design effort
• Fully symmetrical layouts for better current distribution and higher reliability
• Now available with phase-change thermal interface material

 

 

Applications

• Solar
• UPS

 

Samples may be sourced on demand from our usual channels.
 

​【Vincotech is a trademark of Vincotech Holdings S.à.r.l.】​​​​